Implementation of the ASEAN+3 Multi-Currency Bond Issuance Framework: ASEAN+3 Bond Market Forum Sub-Forum 1 Phase 3 Report

Publication | September 2015

While the ASEAN+3 Multi-Currency Bond Issuance Framework is still at a very early stage of development, related market practices need to evolve as bond issuances increase.

Price
  • US$36.00 (paperback)

The ASEAN+3 Multi-Currency Bond Issuance Framework (AMBIF) is a policy initiative under the Asian Bond Markets Initiative (ABMI) to help facilitate intraregional transactions through standardized bond and note issuance and investment processes. By doing so, it will facilitate the process of recycling savings within the region in a practical and efficient manner.

AMBIF facilitates intraregional bond and note issuance and investment by creating common market practices; utilizing a common document for submission, the Single Submission Form; and highlighting transparent issuance procedures as documented in the Implementation Guidelines for each participating market. AMBIF is expected to support closer economic and financial linkages among ASEAN+3 economies, thus serving the objective of ABMI to effectively channel the region’s abundant savings toward financing its increasing investment needs.

This report represents the findings and conclusions of the The ASEAN+3 Bond Market Forum (ABMF) Sub-Forum 1 during its Phase 3.

Contents 

  • Statement from SF1 Chairs
  • Executive Summary
  • General Description of AMBIF
  • Implementation of AMBIF
  • AMBIF Bond and Note Issuance: Relevant Features across ASEAN+3 Markets
  • AMBIF Implementation Guidelines for Participating Markets
  • Recommendations and Next Steps
  • Appendixes

Additional Details

Type
Subjects
  • Finance sector development
  • Finance sector reform
  • Financial markets and institutions
  • Regional cooperation and integration
Countries/Economies
  • Hong Kong, China
  • Japan
  • Malaysia
  • Philippines
  • Singapore
  • Thailand
Pages
  • 220
Dimensions
  • 8.5 x 11
SKU
  • RPT157592-2
ISBN
  • 978-92-9257-079-8 (print)
  • 978-92-9257-080-4 (electronic)

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